David Stark founded EverSealed Windows, Inc., in July 2005, to address market opportunities for super-insulating glass applications. From 1978 to 1999, David was a senior engineer and manager for the Defense Systems and Electronics Group (DSEG) of Texas Instruments and later Raytheon Corporation. While at TI / Raytheon, David successfully led a high profile, industry-wide effort to develop advanced manufacturing technologies for the electronics industry. He also oversaw the design, layout and start-up of seven factories for manufacturing advanced electronics.
David’s original focus was packaging for optical micro-electronic components. In 2002, he undertook extensive research into other commercial applications for hermetic metal-to-glass seals, and recognized a substantial business opportunity for super-insulating windows in the fenestration industry.
Since 2001, David has conceived, developed and demonstrated the Metal-to-Glass Diffusion Bonding Process used in ESW’s Solution. He has been awarded seven U.S. patents, with many more pending, in the areas of vacuum window assemblies, diffusion bonding, hermetic metal-to-glass seals, opto-electronics packaging and hermetic semiconductor wafer-level packaging.
David is a professional engineer, with a B.S. degree in industrial engineering from Rutgers University and an M.B.A. from Southern Methodist University. He is a past member of the Institute of Electrical and Electronics Engineers’ Technical Committee for MEMS Packaging and the U.S. Green Building Council (USGBC).
David’s original focus was packaging for optical micro-electronic components. In 2002, he undertook extensive research into other commercial applications for hermetic metal-to-glass seals, and recognized a substantial business opportunity for super-insulating windows in the fenestration industry.
Since 2001, David has conceived, developed and demonstrated the Metal-to-Glass Diffusion Bonding Process used in ESW’s Solution. He has been awarded seven U.S. patents, with many more pending, in the areas of vacuum window assemblies, diffusion bonding, hermetic metal-to-glass seals, opto-electronics packaging and hermetic semiconductor wafer-level packaging.
David is a professional engineer, with a B.S. degree in industrial engineering from Rutgers University and an M.B.A. from Southern Methodist University. He is a past member of the Institute of Electrical and Electronics Engineers’ Technical Committee for MEMS Packaging and the U.S. Green Building Council (USGBC).